Thermal Links

Thermal links provide a means of transferring heat from a warm component to a cooler reservoir with minimal temperature drop. The standard soldered approach is time consuming and adds thermal impedance to the link, degrading performance. To maximize performance, SDL has developed a solderless thermal link design.

SDL’s improved solderless thermal link technology enables an extremely efficient thermal connection while maintaining a high degree of mechanical flexibility and adaptability to new design parameters. Using a solderless process to attach a stack of aluminum foils into aluminum end blocks, SDL’s design essentially removes any contact resistance between the metals.

SDL’s solderless thermal link design:

  • Allows more flexibility
  • Minimizes weight
  • Conducts heat with minimal temperature loss
  • Protects fragile cryo-cooler cold fingers
  • Decreases contamination risks associated with previous thermal link technologies