Thermal links provide a means of transferring heat from a warm component to a cooler reservoir with minimal temperature drop. The standard soldered approach is time consuming and adds thermal impedance to the link, degrading performance. To maximize performance, SDL has developed a solderless thermal link design.
SDL’s improved solderless thermal link technology enables an extremely efficient thermal connection while maintaining a high degree of mechanical flexibility and adaptability to new design parameters. Using a solderless process to attach a stack of aluminum foils into aluminum end blocks, SDL’s design essentially removes any contact resistance between the metals.
SDL’s solderless thermal link design:
- Allows more flexibility
- Minimizes weight
- Conducts heat with minimal temperature loss
- Protects fragile cryo-cooler cold fingers
- Decreases contamination risks associated with previous thermal link technologies