Thermal Links

SDL’s simple process for developing solderless thermal links enables an extremely efficient thermal connection while maintaining a high degree of mechanical flexibility. Our versatile thermal link technology is easily adapted to fit new design parameters and we have the facilities to design, manufacture, and test cryogenic support structures that meet the highest engineering standards and requirements.

  • Solderless design for maximized performance
  • Enables a high degree of flexibility
  • Minimizes weight
  • Conducts heat with minimal temperature loss
  • Protects fragile cryocooler cold fingers
  • Decreases contamination risks associated with solder designs
  • Adapts easily to new design parameters
  • Removes contact resistance between metals
  • Extensive space-flight heritage